EMULATION

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EMULATION BPW6763BG02630 BGA SOCKET, 676POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:676, PITCH SPACING:1MM, CONTACT MATERIAL:BERYLLIUM COPPER, PEAK REFLOW COMPATIBLE
EMULATION BPW-256-2BG020-70 BGA SOCKET, 256POS, THROUGH HOLE, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:256, PITCH SPACING:1.27MM, CONTACT TERMINATION:THROUGH HOLE VERTICAL, CON
EMULATION BPW6522BG03530 BGA SOCKET, 652POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:652, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION CLIP-048-TS01-KIT TEST CLIP KIT, 48POS, CONNECTOR TYPE:TEST CLIP, CONTACT PLATING:GOLD, KIT CONTENTS:TSOP CLIPS, LEADED PROCESS COMPATIBLE:NO, NO. OF CONTACTS:48, PEAK
EMULATION CLIP-056-TS01-KIT TEST CLIP KIT, 56POS, CONNECTOR TYPE:TEST CLIP, CONTACT PLATING:GOLD, KIT CONTENTS:TSOP CLIPS, LEADED PROCESS COMPATIBLE:NO, NO. OF CONTACTS:56, PEAK
EMULATION MIC38-CABLE-MM-9 RIBBON CABLE, MICTOR PLG 38WAY 0.229M BLK, NO. OF CONDUCTORS:38, CABLE ASSEMBLY TYPE:RIBBON, CABLE LENGTH - IMPERIAL:9, CABLE LENGTH - METRIC:228.6MM
EMULATION BPW5602BG03330 BGA SOCKET, 560POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:560, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION MIC-152-BREAKOUT-MALE 152 PIN MICTOR BREAKOUT ADAPTER, MALE TO .025 SQUARE TEST POINTS
EMULATION MIC-38-CABLE-MM-6 38 PIN MICTOR CABLE, MALE TO MALE. 6 INCHES LONG
EMULATION BPW4562BG02670 BGA SOCKET, 456POS, THROUGH HOLE, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:456, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT TERMINATION:THROUGH
EMULATION MIC-38-CABLE-MF-3 MICTOR 38 CABLE, MALE TO FEMALE, 3 INCHES LONG
EMULATION BPW4562BG02630 BGA SOCKET, 456POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:456, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION FP-2S-10 (PRICE/PK OF 10) GRIPPER, 1POS, OVERALL LENGTH:33, LEAD LENGTH:8, CONTACT MATERIAL:STEEL, CONTACT PLATING:NICKEL, LEADED PROCESS COMPATIBLE:YES, NO.
EMULATION BPW3882BG02630 BGA SOCKET, 388POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:388, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION BPW3522BG02630 BGA SOCKET, 352POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:352, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION AS-44-44-01S-6YAM-GANG CONNECTOR
EMULATION FP-7CL-10 (PRICE/PK OF 10) IC SOCKET TEST CLIP, OVERALL LENGTH:33, LEAD LENGTH:13, INSULATOR COLOR:VIOLET, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, P
EMULATION BC4-84-PCC5-0000 PLCC SOCKET, 84POS, THROUGH HOLE, CONVERT FROM:84-PLCC, CONVERT TO:84-PLCC, PITCH SPACING:2.54MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:PLCC SOCKET
EMULATION FP-2CL-10 (PRICE/PK OF 10) GRIPPER, 1POS, CONTACT MATERIAL:STEEL, CONTACT PLATING:NICKEL, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REFLOW COMPATIB
EMULATION BPW2722BG02070 BGA SOCKET, 272POS, THROUGH HOLE, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:272, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT TERMINATION:THROUGH
EMULATION FP-7C-10 (PRICE/PK OF 10) IC SOCKET TEST CLIP, OVERALL LENGTH:33, LEAD LENGTH:13, INSULATOR COLOR:VIOLET, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, P
EMULATION FP-2BL-10 (PRICE/PK OF 10) GRIPPER, 1POS, ACCESSORY TYPE:GRIPPER, CONTACT MATERIAL:STEEL, CONTACT PLATING:NICKEL, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS
EMULATION BPW3082BG02030 BGA SOCKET, 400POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:400, PITCH SPACING:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PEAK REFLOW COMPATIB
EMULATION S-QFP-SM-176-D OPEN TOP SURFACE MOUNT SOCKET, 176 PIN QFP, 0.50MM PITCH, 24MM BODY, 26MM TIP TO TIP, W/OUT POSITIONING PIN
EMULATION 100-5BG010S PROTOTYPING BOARD, BGA/CSP, GLASS EPOXY, BOARD MATERIAL:GLASS EPOXY, HOLE DIAMETER:0.5MM, EXTERNAL HEIGHT:76.2MM, EXTERNAL WIDTH:76.2MM, BOARD THICKNE
EMULATION FP-2C-10 (PRICE/PK OF 10) GRIPPER, 1POS, CONTACT MATERIAL:STEEL, CONTACT PLATING:NICKEL, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REFLOW COMPATIB
EMULATION BCM-038-MICTOR-0000 ADAPTER, MICTOR 38 PIN PROBE ADAPTER, ROHS COMPLIANT: NO
EMULATION BPW2722BG02030 BGA SOCKET, 272POS, SMD, CONNECTOR TYPE:BGA SOCKET, NO. OF CONTACTS:272, PITCH SPACING:1.27MM, ROW PITCH:1.27MM, CONTACT MATERIAL:BERYLLIUM COPPER, PE
EMULATION FP-2B-10 (PRICE/PK OF 10) GRIPPER, 1POS, ACCESSORY TYPE:GRIPPER, CONTACT MATERIAL:STEEL, CONTACT PLATING:NICKEL, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS
EMULATION ET-413 USB PEN MICROSCOPE, 2MP, 200X, MAGNIFICATION:10X TO 200X, FOR USE WITH:ELECTRIC CIRCUITS, STAMPS, COINS, ANTIQUES, INSECTS, MACHINES, FABRICS DECORA
EMULATION FP-HR-1 IC SOCKET TEST CLIP, OVERALL LENGTH:29, LEAD LENGTH:13, INSULATOR COLOR:BROWN, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:2, PEAK REFLOW COMPATI
EMULATION CQ32ENL CHIP QUIK REMOVAL ALLOY, 32FT, LENGTH:32FT, ACCESSORY TYPE:REMOVAL ALLOY, NO LEAD, FOR USE WITH:DESOLDERING
EMULATION BC4-68-PCC1-0000 PLCC SOCKET, 68POS, THROUGH HOLE, CONVERT FROM:68-PLCC, CONVERT TO:68-PLCC, PITCH SPACING:2.54MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:PLCC SOCKET
EMULATION FP2S/GRP1-PRB-2 (PRICE/PK OF 2) TEST PROBE, TEST PROBE TYPE:OSCILLOSCOPE, FOR USE WITH:ET MICROGRIPPER OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPAT
EMULATION BC4-44-PCC3-0000 PLCC SOCKET, 44POS, THROUGH HOLE, CONVERT FROM:44-PLCC, CONVERT TO:44-PLCC, PITCH SPACING:2.54MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:PLCC SOCKET
EMULATION CQ16ENL CHIP QUIK REMOVAL ALLOY, 16FT, ACCESSORY TYPE:REMOVAL ALLOY, FOR USE WITH:DESOLDERING
EMULATION BC4-32-PCC7-0000 PLCC SOCKET, 32POS, THROUGH HOLE, CONVERT FROM:32-PLCC, CONVERT TO:32-PLCC, PITCH SPACING:2.54MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:PLCC SOCKET
EMULATION FP2BGRP1PRB2 TEST PROBE, TEST PROBE TYPE:OSCILLOSCOPE, FOR USE WITH:ET MICROGRIPPER OSCILLOSCOPES, PEAK REFLOW COMPATIBLE (260 C):NO, LEADED PROCESS COMPATIBLE:NO
EMULATION 324-6BG018S-GEN SMD TO PIN OUT ADAPTER - BGA-324, BOARD TYPE:PCB, IC TO PIN OUT ADAPTER, BOARD MATERIAL:FR4, HOLE DIAMETER:0.96MM, EXTERNAL HEIGHT:76.2MM, EXTERNAL WI
EMULATION FP2B064PRB2 (PRICE/PK OF 2) TEST PROBE, TEST PROBE TYPE:OSCILLOSCOPE, FOR USE WITH:ET MICROGRIPPER OSCILLOSCOPES, BANDWIDTH:100MHZ, INPUT VOLTAGE MAX:40V, LEADED
EMULATION ST3882BG0266 PRICE/PK OF 10 (MIN PURCH = 5 PK) BGA REWORK STENCIL, BODY MATERIAL:ANTI-STATIC POLYMER FILM, ROHS COMPLIANT: YES
EMULATION 324-3BG018S-GEN SMD TO PIN OUT ADAPTER - BGA-324, BOARD TYPE:PCB, IC TO PIN OUT ADAPTER, BOARD MATERIAL:FR4, HOLE DIAMETER:0.96MM, EXTERNAL HEIGHT:74.93MM, EXTERNAL W
EMULATION FP-LA1C-10 (PRICE/PK OF 10) IC SOCKET TEST CLIP, OVERALL LENGTH:233MM, LEAD LENGTH:200MM, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REFLOW COMPATIBL
EMULATION FP-HP-1 (PRICE/PK OF 10) IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:2, PEAK REFLOW COMPATIBLE (260 C):YES, RO
EMULATION PN100 PICK-UP TOOL, VACUUM, 6.2IN, LIFTER TYPE:SUCTION, LENGTH:6.2, EXTERNAL DIAMETER:12.7MM, ROHS COMPLIANT: YES
EMULATION ST2722BG0206 BGA REWORK STENCIL, WIDTH:27MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:27MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE
EMULATION AS323201TS6YAMGA IC ADAPTER, 32-TSOP TO 32-DIP, CONVERT FROM:32-TSOP, CONVERT TO:32-DIP, PITCH SPACING:2.54MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:TSOP ADAPTER, N
EMULATION 324-2BG018S-GEN SMD TO PIN OUT ADAPTER - BGA-324, BOARD TYPE:PCB, IC TO PIN OUT ADAPTER, BOARD MATERIAL:FR-4, HOLE DIAMETER:0.96MM, EXTERNAL HEIGHT:76.2MM, EXTERNAL W
EMULATION H450307901605A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:5.6C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION H425309902005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:5.6C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION AS323201P6YAMLN IC ADAPTER, 32-PLCC TO 32-DIP, CONVERT FROM:32-PLCC, CONVERT TO:32-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, SOCKET MOUNTING:PC BOARD, CONNECTOR T
EMULATION H400307904005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:7.1C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION H375307901505A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:7.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION H350307903805A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:8.6C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION AS-28-28-02SS-6ENP-GANG IC ADAPTER, 28-SSOP TO 28-DIP, CONVERT FROM:28-SSOP, CONVERT TO:28-DIP, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADED PROCESS COMPATIBLE:NO
EMULATION AS-28-28-03S-6-GANG IC ADAPTER, 28-SOIC TO 28-DIP, CONVERT FROM:28-SOIC, CONVERT TO:28-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADED
EMULATION ST2922BG0206 BGA REWORK STENCIL, WIDTH:27MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:27MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE
EMULATION ST3243BG0184 PRICE/PK OF 10, BGA REWORK STENCIL, BODY MATERIAL:ANTI-STATIC POLYMER FILM, ROHS COMPLIANT: YES
EMULATION H230303901705A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:20.1C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION H250301903105A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:16.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION H270305900005A HEAT SINK, PACKAGES COOLED:BGA, THERMAL RESISTANCE:15.5C/W, EXTERNAL HEIGHT - METRIC:7.62MM, PEAK REFLOW COMPATIBLE (260 C):YES, HEIGHT:7.62MM, LEADED
EMULATION FP-T23-04 MICROCLIP FOR 0402 COMPONENTS
EMULATION 290N-SUN CHIP PULLER
EMULATION ST3042BG16X198 BGA REWORK STENCIL, WIDTH:25MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLE
EMULATION ST3243BG0224 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE
EMULATION ST3522BG0266 BGA REWORK STENCIL, WIDTH:35MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:35MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE
EMULATION ST2082BG0174 BGA REWORK STENCIL, WIDTH:23MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:23MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.152MM, SERIES:FLE
EMULATION ST1963BG0144 BGA REWORK STENCIL, WIDTH:15MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:15MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE
EMULATION ST2563BG0164 BGA REWORK STENCIL, WIDTH:17MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:17MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.102MM, SERIES:FLE
EMULATION ST2562BG0168 BGA REWORK STENCIL, WIDTH:21MM, PEAK REFLOW COMPATIBLE (260 C):YES, LENGTH:21MM, BODY MATERIAL:ANTI-STATIC POLYMER FILM, THICKNESS:0.203MM, SERIES:FLE
EMULATION CQ08E SMD REMOVAL ALLOY, WIRE, CLEANER APPLICATIONS:PCBS, SERIES:CHIPQUIK, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT:
EMULATION AS-08-08-01S-3 IC ADAPTER, 8-SOIC TO 8-DIP, CONVERT FROM:8-SOIC, CONVERT TO:8-DIP, PITCH SPACING:2.54MM, ROW PITCH:7.62MM, CONNECTOR TYPE:SOCKET ADAPTER, LEADED PROC
EMULATION S-SSO-00-024-C S-SSO-00-024-C,BI SKT (24-SS03).173IN BDY .65MMPTC
EMULATION FOP1 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES DOWN TO 0.2MM TO 0.3MM LEAD PITCH, LEADED PROCESS COMPATIBLE:NO, PEAK REF
EMULATION AB-044-SO09S-A-M IC ADAPTER, 44-SOIC TO 44-DIP, CONVERT FROM:44-SOIC, CONVERT TO:44-DIP, PITCH SPACING:1.27MM, ROW PITCH:15.24MM, SOCKET MOUNTING:PC BOARD, CONNECTOR T
EMULATION FP-1B30 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REF
EMULATION CQ08ENL , LENGTH:4FT, APPROVAL CATEGORIES:REMOVAL ALLOY, NO LEAD, FOR USE WITH:DESOLDERING
EMULATION AB-020-ST03S-A.3-W ADAPTER, 20 PIN SSOP, 0.65MM PITCH,
EMULATION AB020ST03SAW.3 AB020ST03SAW.3
EMULATION CQ291E FLUX REMOVER, SYRINGE, CLEANER TYPE:FLUX REMOVER, DISPENSING METHOD:SYRINGE, SERIES:CHIPQUIK, VOLUME:10CC, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW C
EMULATION AB-028-SS01S-A-M IC ADAPTER, 28-SSOP TO 28-DIP, CONVERT FROM:28-SSOP, CONVERT TO:28-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONVER
EMULATION CQ123ENL CHIP QUICK SMD REMOVAL KIT, KIT CONTENTS:2.5FT LEAD FREE REMOVAL ALLOY, 1CC NO CLEAN TACK FLUX, 4 ALCOHOL PADS
EMULATION FP-1B10 IC SOCKET TEST CLIP, ACCESSORY TYPE:GRIPPER, FOR USE WITH:LOGIC ANALYZER AND OSCILLOSCOPES, LEADED PROCESS COMPATIBLE:YES, NO. OF CONTACTS:1, PEAK REF
EMULATION CQ123E SMD REMOVAL KIT, WIRE, CLEANER APPLICATIONS:PCBS, LEADED PROCESS COMPATIBLE:NO, PEAK REFLOW COMPATIBLE (260 C):NO, ROHS COMPLIANT: NO
EMULATION BC4-44-SPACER-G SOCKET ADAPTER, 44POS, THROUGH HOLE, CONVERT FROM:44-PLCC, CONVERT TO:44-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET A
EMULATION BC4-32-SPACER-G SOCKET ADAPTER, 32POS, THROUGH HOLE, CONVERT FROM:32-PLCC, CONVERT TO:32-PLCC, PITCH SPACING:1.27MM, SOCKET MOUNTING:PC BOARD, CONNECTOR TYPE:SOCKET A
EMULATION AB-020-ST03S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, LEAD
EMULATION CQ291ENL FLUX, SYRINGE, 10CC, FLUX TYPE:NO CLEAN, SERIES:CHIPQUIK, FLUX APPLICATIONS:SOLDERING, DISPENSING METHOD:SYRINGE, VOLUME:10CC
EMULATION AB-020-ST35S-A-M IC ADAPTER, 20-TSSOP TO 20-DIP, CONVERT FROM:20-TSSOP, CONVERT TO:20-DIP, PITCH SPACING:2.54MM, ROW PITCH:15.24MM, CONNECTOR TYPE:SOCKET ADAPTER, CONV
EMULATION S-TSO-SM-048-B TSOP SOCKET, 48POS, SMD, CONNECTOR TYPE:TSOP SOCKET, SERIES:-, NO. OF CONTACTS:48, PITCH SPACING:0.5MM, ROW PITCH:18.4MM, CONTACT TERMINATION:SURFACE
EMULATION POGO-PIN-19.0-1 POGO PIN 19.05MM OVERALL LENGTH, 0.91MM BARREL DIAMETER, DOUBLE ENDED RADIUS PLUNGERS
EMULATION POGO-PIN-17.5-1 POGO PIN 17.5MM LENGTH, 0.51MM BARREL DIAMETER, SINGLE ENDED RADIUS PLUNGER,39 GRAMS OF SPRING FORCE AT 2/3 TRAVEL
EMULATION HEADERMALE32 BOARD-BOARD CONN, HEADER, 32WAY, 1ROW, PITCH SPACING:2.54MM, NO. OF ROWS:1, NO. OF CONTACTS:32, GENDER:HEADER, CONTACT TERMINATION:THROUGH HOLE VERTIC
EMULATION POGOPIN1301 TEST POINT, PCB, CONNECTOR TYPE:TEST POINT, CONNECTOR TIP STYLE:POINT, CURRENT RATING:5A, OVERALL LENGTH:13MM, SPRING FORCE INITIAL:1OZ, SPRING FORCE
EMULATION POGO-REC-17.5-1 POGO-REC-17.5-1CONNECTOR
EMULATION FOP-3 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCE
EMULATION FOP-4 CONNECTOR ASSEMBLIES, TEST LEADS TELEPHONE CABLES, FOR USE WITH:SMT PACKAGES UP TO 0.5MM LEAD PITCH WITH LOGIC ANALYZER OR OSCILLOSCOPES, LEADED PROCE
EMULATION WWPOST-40-PGA PCB, PROTOTYPING BOARD, NO. OF CONTACTS:1, GENDER:PIN, CONTACT TERMINATION:THROUGH HOLE VERTICAL, CONNECTOR TYPE:WIRE STRIP, PEAK REFLOW COMPATIBLE (2
EMULATION FP-T23-08 (PRICE/EA) MICROCLIP FOR 0805 COMPONENTS
EMULATION MIC-38-CABLE-MM-18 (PRICE/EACH), 38 PIN MICTOR CABLE, MALE TO MALE
EMULATION MIC-38-CABLE-MM-24 38 PIN MICTOR CABLE, MALE TO MALE, 24 INCHES LONG
EMULATION ET-5403A PRO SERIES SOFT TOUCH RETENTION MODULE
EMULATION BCM-076-MICTOR-0000 PROBE ADAPTER
EMULATION MIC-38-CABLE-MF-18 MICTOR 38 CABLE, MALE TO FEMALE, 18 INCHES LONG
EMULATION MIC-38-CABLE-MF-24 MICTOR 38 CABLE, MALE TO FEMALE, 24 INCHES LONG PER DRAWING
EMULATION MIC38-CABLE-MM-12 38 PIN MICTOR CABLE, MALE TO MALE, 12 INCHES LONG